An improved method of screen printing is described wherein a double sided tape (dry film) is applied between the substrate and the screened-on paste. Since the dry film ensures the adhesion of the paste, no minimum thickness of paste is needed to attain good adhesion. By applying a thin layer of paste multiple times any thickness over a wide range can be obtained. Once the desired thickness of paste has been applied, the dry film is removed by firing in an oxidizing atmosphere. The method is applicable to, among others, phosphors, resistive materials, and conductive materials.